Description
Features:
Aluminum alloy die casting process is adopted to facilitate heat dissipation when assembling LED lamps and lanterns
Using drive free technology, the chip has low light attenuation, better heat dissipation effect, and maintains the durability of lamps and lanterns
With high light transmittance PC material, high transmittance and low temperature are not available, and the irradiation angle range is larger
Fullysealed design, ultra lowtemperature resistance, no cracking when exposed to water, electrical insulation performance, safe use
